The Sensel Morph and Overlays
Began shipping February 2017.
Took the Morph (a cutting edge pressure sensitive device) and the Overlays (swappable silicone rubber interfaces) from concept to market.
Owned 90% of the non-EE BOM of the Morph and 90% of the Overlays from design, quality, supply chain, supplier management, reliability, and manufacturing.
Designed production parts for machining, compression molding, injection molding, lamination, converting, magnets, packaging, conductive inks, multi-substrate stack-ups, screen printing, sheet thermoforming, cable manufacturing, and FATP. Working knowledge of die casting, stamping, soft goods, PCB (schematics, layout, fab, and SMT).
15 Asia visits (China with some Japan and Taiwan), 30+ FAIs, 40+ factory evaluations, tolerance stack-ups, intermediate GD&T, owned our BOMs and PLM (Arena), wrote 7 cosmetic specs and various reliability testing profiles.
Co-owned our CM relationship and handled quality, schedule, product cost structure, ECOs, and FATP instructions. Managed our ocean freight, and have developed a healthy hate for customs of every country.
Past the first year with the Morph and as our team grew, I lost a couple hats but deepened many of the technical verticals I created during the Morph. I also developed some new ones including haptics actuators and mounting, ultra-thin designs, trackpad stack-ups, intermediate FEA (static, thermal), lamination, and rubbers.
9 design patents, 2 technical patents.
Learned all this with the guidance and mentorship of consultants, my existing mentors, new found Senior ME buds, and a lot of hustle.